Why it matters

B200 is the next-gen upgrade path. Understanding shapes infrastructure roadmaps.

Advertisement

The architecture

Dual-die package: 2 GPU dies with 10 TB/s chip-to-chip.

HBM3e: 192 GB, 8 TB/s.

FP4 tensor cores: 4-bit for inference.

B200 upgradesDual-die + NV-HBI10 TB/s die-to-die192 GB HBM3e8 TB/sFP4 tensor coresfor inferenceMarketed as up to 30x inference vs H100 for large models via FP4 + scaling
B200 features.
Advertisement

How it works end to end

NVLink 5: 1.8 TB/s. Higher than H100's 900 GB/s.

Rack-scale GB200 NVL72: 72 GPUs as one system.

Power: 1000W per GPU. Cooling implications.